Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137536 | Sn-Cu-based lead-free solder alloy | Tsukasa Ohnishi, Seiko Ishibashi, Rei Fujimaki | 2018-11-27 |
| 10076808 | Lead-free solder alloy | Tsukasa Ohnishi, Ken Tachibana, Yoshie Yamanaka, Hikaru Nomura, Kyu Oh Lee | 2018-09-18 |
| 9987710 | Solder paste | Motoki Koroki, Sakie Okada, Taro Itoyama, Hideyuki KOMURO, Naoko Hirai +1 more | 2018-06-05 |