Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037976 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Nitesh Nimkar | 2018-07-31 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Yoshihiro Tomita | 2018-06-05 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2018-02-20 |