Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10037976 | Scalable package architecture and associated techniques and configurations | Bassam M. Ziadeh, Nitesh Nimkar | 2018-07-31 |
| 9922916 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2018-03-20 |