Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10090277 | 3D integrated circuit package with through-mold first level interconnects | Robert L. Sankman | 2018-10-02 | $23,827,000 |
| 10074357 | Integrated acoustic phase array | Sasikanth Manipatruni, Kelin J. Kuhn, John C. Johnson | 2018-09-11 | $19,778,000 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita | 2018-02-20 | $17,556,000 |
| 9871026 | Embedded memory and power management subpackage | John S. Guzek, Sasha N. Oster, Timothy McIntosh | 2018-01-16 | $17,139,000 |