Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991211 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2018-06-05 |
| 9953929 | Systems and methods for electromagnetic interference shielding | Anna M. Prakash, Joshua D. Heppner, Eric J. Li, Nachiket R. Raravikar | 2018-04-24 |
| 9887104 | Electronic package and method of connecting a first die to a second die to form an electronic package | Manish Dubey, Patrick Nardi, David Woodhams | 2018-02-06 |