| 10103054 |
Coupled vias for channel cross-talk reduction |
Zhichao Zhang, Zhiguo Qian, Tolga Memioglu |
2018-10-16 |
| 10056528 |
Interposer structures, semiconductor assembly and methods for forming interposer structures |
Zhiguo Qian |
2018-08-21 |
| 10026682 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2018-07-17 |
| 9971089 |
Chip-to-chip interconnect with embedded electro-optical bridge structures |
Zhichao Zhang, Robert L. Sankman |
2018-05-15 |
| 9935063 |
Rlink-on-die inductor structures to improve signaling |
Yu Zhang, Jihwan Kim, Ajay Balankutty, Anupriya Sriramulu, Md. Mohiuddin Mazumder +2 more |
2018-04-03 |
| 9922751 |
Helically insulated twinax cable systems and methods |
Zhichao Zhang, Gong Ouyang, Kai Xiao, Eric J. Li |
2018-03-20 |
| 9894752 |
Inductors for circuit board through hole structures |
Zhichao Zhang, Gong Ouyang, Kai Xiao, Beom-Taek Lee |
2018-02-13 |