Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147710 | Method of embedding WLCSP components in E-WLB and E-PLB | Thorsten Meyer | 2018-12-04 |
| 10122089 | Magnetic nanocomposite materials and passive components formed therewith | Chuan Hu, Shawna M. Liff, Larry E. Mosley | 2018-11-06 |
| 10032052 | Piezoelectric package-integrated delay lines for radio frequency identification tags | Adel A. Elsherbini, Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Johanna M. Swan +1 more | 2018-07-24 |
| 10014277 | Single layer low cost wafer level packaging for SFF SiP | Chuan Hu | 2018-07-03 |
| 9991239 | Method of embedding WLCSP components in e-WLB and e-PLB | Thorsten Meyer | 2018-06-05 |