Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2018-10-30 | $31,457,000 |
| 9929080 | Forming a stress compensation layer and structures formed thereby | Daewoong Suh | 2018-03-27 | $21,620,000 |
| 9859253 | Integrated circuit package stack | John S. Guzek, Yidnekachew S. Mekonnen | 2018-01-02 | $11,729,000 |