Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2018-10-30 |