| 9847388 |
High thermal budget compatible punch through stop integration using doped glass |
Kangguo Cheng, Xin Miao, Chun-Chen Yeh |
2017-12-19 |
| 9773901 |
Bottom spacer formation for vertical transistor |
Oleg Gluschenkov, Shogo Mochizuki, Alexander Reznicek |
2017-09-26 |
| 9748382 |
Self aligned top extension formation for vertical transistors |
Oleg Gluschenkov, Shogo Mochizuki, Alexander Reznicek |
2017-08-29 |
| 9748359 |
Vertical transistor bottom spacer formation |
Oleg Gluschenkov, Shogo Mochizuki, Alexander Reznicek |
2017-08-29 |
| 9741813 |
Pure boron for silicide contact |
Chia-Yu Chen, Zuoguang Liu, Tenko Yamashita |
2017-08-22 |
| 9735248 |
Pure boron for silicide contact |
Chia-Yu Chen, Zuoguang Liu, Tenko Yamashita |
2017-08-15 |
| 9735054 |
Gate tie-down enablement with inner spacer |
Su Chen Fan, Andre P. Labonte, Lars Liebmann |
2017-08-15 |
| 9653573 |
Replacement metal gate including dielectric gate material |
Linus Jang, Sivananda K. Kanakasabapathy, Soon-Cheon Seo, Raghavasimhan Sreenivasan |
2017-05-16 |
| 9640514 |
Wafer bonding using boron and nitrogen based bonding stack |
Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy +2 more |
2017-05-02 |
| 9634110 |
POC process flow for conformal recess fill |
Andrew M. Greene, Balasubramanian Pranatharthiharan, Ruilong Xie |
2017-04-25 |
| 9627257 |
Gate tie-down enablement with inner spacer |
Su Chen Fan, Andre P. Labonte, Lars Liebmann |
2017-04-18 |
| 9607825 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more |
2017-03-28 |
| 9583489 |
Solid state diffusion doping for bulk finFET devices |
Brent A. Anderson, Hemanth Jagannathan, Balasubramanian Pranatharthiharan |
2017-02-28 |
| 9576954 |
POC process flow for conformal recess fill |
Andrew M. Greene, Balasubramanian Pranatharthiharan, Ruilong Xie |
2017-02-21 |
| 9564370 |
Effective device formation for advanced technology nodes with aggressive fin-pitch scaling |
Injo Ok, Balasubramanian Pranatharthiharan, Soon-Cheon Seo, Charan V. Surisetty |
2017-02-07 |
| 9558934 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more |
2017-01-31 |
| 9558935 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more |
2017-01-31 |
| 9536981 |
Field effect transistor device spacers |
Xiuyu Cai, Tenko Yamashita |
2017-01-03 |
| 9536733 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more |
2017-01-03 |
