Wei Lin — 7 Patents at IBM | Patent Leaderboard

Issued Patents 2017

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9847295	Enhancing barrier in air gap technology	Takeshi Nogami	2017-12-19	$7,368,000
9806032	Integrated circuit structure with refractory metal alignment marker and methods of forming same	Nailong HE, Upinder Singh	2017-10-31	$7,902,000
9640514	Wafer bonding using boron and nitrogen based bonding stack	Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy, Binglin Miao +2 more	2017-05-02	$5,255,000
9620481	Substrate bonding with diffusion barrier structures	Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more	2017-04-11	$14,156,000
9564386	Semiconductor package with structures for cooling fluid retention	Son V. Nguyen, Spyridon Skordas, Tuan A. Vo	2017-02-07	$2,910,000
9553054	Strain detection structures for bonded wafers and chips	Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Spyridon Skordas, Kevin R. Winstel	2017-01-24	$6,909,000
9536853	Semiconductor device including built-in crack-arresting film structure	Leathen Shi, Spyridon Skordas, Kevin R. Winstel	2017-01-03	$2,646,000