| 9847295 |
Enhancing barrier in air gap technology |
Takeshi Nogami |
2017-12-19 |
| 9806032 |
Integrated circuit structure with refractory metal alignment marker and methods of forming same |
Nailong HE, Upinder Singh |
2017-10-31 |
| 9640514 |
Wafer bonding using boron and nitrogen based bonding stack |
Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy, Binglin Miao +2 more |
2017-05-02 |
| 9620481 |
Substrate bonding with diffusion barrier structures |
Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more |
2017-04-11 |
| 9564386 |
Semiconductor package with structures for cooling fluid retention |
Son V. Nguyen, Spyridon Skordas, Tuan A. Vo |
2017-02-07 |
| 9553054 |
Strain detection structures for bonded wafers and chips |
Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Spyridon Skordas, Kevin R. Winstel |
2017-01-24 |
| 9536853 |
Semiconductor device including built-in crack-arresting film structure |
Leathen Shi, Spyridon Skordas, Kevin R. Winstel |
2017-01-03 |
