Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852959 | Corrosion resistant chip sidewall connection with crackstop and hermetic seal | Michael J. Shapiro, Natalia Borjemscaia, Vincent J. McGahay | 2017-12-26 |
| 9818637 | Device layer transfer with a preserved handle wafer section | Anthony K. Stamper, Mukta G. Farooq, Mark D. Jaffe, Randy L. Wolf | 2017-11-14 |
| 9812404 | Electrical connection around a crackstop structure | Michael J. Shapiro, Natalia Borjemscaia | 2017-11-07 |
| 9806025 | SOI wafers with buried dielectric layers to prevent Cu diffusion | Anthony K. Stamper, Mukta G. Farooq | 2017-10-31 |
| 9671215 | Wafer to wafer alignment | Mukta G. Farooq, Spyridon Skordas | 2017-06-06 |
| 9673176 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, Mukta G. Farooq | 2017-06-06 |
| 9666563 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, Mukta G. Farooq | 2017-05-30 |
| 9653432 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, Mukta G. Farooq | 2017-05-16 |
| 9653431 | Metal to metal bonding for stacked (3D) integrated circuits | Tien-Jen Cheng, Mukta G. Farooq | 2017-05-16 |
| 9589806 | Integrated circuit with replacement gate stacks and method of forming same | Ruqiang Bao, Unoh Kwon, Huihang Dong | 2017-03-07 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, Erdem Kaltalioglu, Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2017-01-24 |
| 9548244 | Self-aligned contact structure | Rosa A. Orozco-Teran, Ravikumar Ramachandran, Russell H. Arndt, David L. Rath | 2017-01-17 |