Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas +1 more | 2017-04-11 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Wei Lin, Spyridon Skordas | 2017-01-24 |
| 9543229 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Spyridon Skordas | 2017-01-10 |
| 9536809 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Spyridon Skordas | 2017-01-03 |
| 9536853 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Spyridon Skordas | 2017-01-03 |