Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2017-04-11 |
| 9583628 | Semiconductor device with a low-K spacer and method of forming the same | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2017-02-28 |
| 9543229 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Spyridon Skordas, Kevin R. Winstel | 2017-01-10 |
| 9536809 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Spyridon Skordas, Kevin R. Winstel | 2017-01-03 |