Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas +1 more | 2017-04-11 |
| 9564386 | Semiconductor package with structures for cooling fluid retention | Wei Lin, Son V. Nguyen, Spyridon Skordas | 2017-02-07 |