Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9784917 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Joyeeta Nag, Jason S. Orcutt, Jean-Olivier Plouchart | 2017-10-10 |
| 9671215 | Wafer to wafer alignment | Mukta G. Farooq, John A. Fitzsimmons | 2017-06-06 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Matthew T. Shoudy, Binglin Miao +2 more | 2017-05-02 |
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Tuan A. Vo +1 more | 2017-04-11 |
| 9564386 | Semiconductor package with structures for cooling fluid retention | Wei Lin, Son V. Nguyen, Tuan A. Vo | 2017-02-07 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Wei Lin, Kevin R. Winstel | 2017-01-24 |
| 9543229 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Kevin R. Winstel | 2017-01-10 |
| 9536809 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Kevin R. Winstel | 2017-01-03 |
| 9536853 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Kevin R. Winstel | 2017-01-03 |