Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9786641 | Packaging optoelectronic components and CMOS circuitry using silicon-on-insulator substrates for photonics applications | Russell A. Budd, Mounir Meghelli, Jason S. Orcutt | 2017-10-10 |
| 9784917 | Low-loss large-grain optical waveguide for interconnecting components integrated on a glass substrate | Stephen M. Gates, Joyeeta Nag, Jason S. Orcutt, Spyridon Skordas | 2017-10-10 |
| 9772463 | Intra chip optical interconnect structure | Russell A. Budd, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2017-09-26 |
| 9742147 | Monolithic integrated photonics with lateral bipolar and BiCMOS | Jin Cai, Effendi Leobandung, Ning Li, Tak H. Ning, Devendra K. Sadana | 2017-08-22 |
| 9716367 | Semiconductor optoelectronics and CMOS on sapphire substrate | Tymon Barwicz, Effendi Leobandung, Ning Li, Devendra K. Sadana | 2017-07-25 |
| 9692106 | Hybrid on-chip and package antenna | Duixian Liu, Arun Natarajan, Scott K. Reynolds | 2017-06-27 |
| 9632251 | Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology | Aydin Babakhani, Steven A. Cordes, Scott K. Reynolds, Peter J. Sorce, Robert E. Trzcinski | 2017-04-25 |
| 9602120 | Analog to digital converter with digital reference voltage signal | Vanessa H-C Chen | 2017-03-21 |
| 9577314 | Hybrid on-chip and package antenna | Duixian Liu, Arun Natarajan, Scott K. Reynolds | 2017-02-21 |
| 9548421 | Optoelectronic devices with back contact | Effendi Leobandung, Ning Li, Tak H. Ning, Devendra K. Sadana | 2017-01-17 |
| 9537199 | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips | Bing Dang, Duixian Liu, Alberto Valdes-Garcia | 2017-01-03 |