Issued Patents 2017
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851379 | Test probe substrate | John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-12-26 |
| 9820395 | Low cost hermetic micro-electronics | John U. Knickerbocker, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-11-14 |
| 9798886 | Bio-medical sensing platform | John U. Knickerbocker, Joana Sofia Branquinho Teresa Maria, Sufi Zafar | 2017-10-24 |
| 9721864 | Low cost hermetic micro-electronics | John U. Knickerbocker, Minhua Lu, Jae-Woong Nah, Robert J. Polastre | 2017-08-01 |
| 9691747 | Manufacture of wafer—panel die package assembly technology | John U. Knickerbocker | 2017-06-27 |
| 9636783 | Method and apparatus for laser dicing of wafers | Russell A. Budd, John U. Knickerbocker | 2017-05-02 |
| 9636782 | Wafer debonding using mid-wavelength infrared radiation ablation | John U. Knickerbocker, Cornelia K. Tsang | 2017-05-02 |
| 9606142 | Test probe substrate | John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang | 2017-03-28 |
| 9586291 | Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release | John U. Knickerbocker, Eric P. Lewandowski, Cornelia K. Tsang | 2017-03-07 |
| 9537199 | Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips | Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia | 2017-01-03 |