| 9851379 |
Test probe substrate |
John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang |
2017-12-26 |
| 9820395 |
Low cost hermetic micro-electronics |
John U. Knickerbocker, Minhua Lu, Jae-Woong Nah, Robert J. Polastre |
2017-11-14 |
| 9798886 |
Bio-medical sensing platform |
John U. Knickerbocker, Joana Sofia Branquinho Teresa Maria, Sufi Zafar |
2017-10-24 |
| 9721864 |
Low cost hermetic micro-electronics |
John U. Knickerbocker, Minhua Lu, Jae-Woong Nah, Robert J. Polastre |
2017-08-01 |
| 9691747 |
Manufacture of wafer—panel die package assembly technology |
John U. Knickerbocker |
2017-06-27 |
| 9636783 |
Method and apparatus for laser dicing of wafers |
Russell A. Budd, John U. Knickerbocker |
2017-05-02 |
| 9636782 |
Wafer debonding using mid-wavelength infrared radiation ablation |
John U. Knickerbocker, Cornelia K. Tsang |
2017-05-02 |
| 9606142 |
Test probe substrate |
John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia K. Tsang |
2017-03-28 |
| 9586291 |
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release |
John U. Knickerbocker, Eric P. Lewandowski, Cornelia K. Tsang |
2017-03-07 |
| 9537199 |
Package structure having an integrated waveguide configured to communicate between first and second integrated circuit chips |
Duixian Liu, Jean-Olivier Plouchart, Alberto Valdes-Garcia |
2017-01-03 |
