| 9851379 |
Test probe substrate |
Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski |
2017-12-26 |
| 9795964 |
Direct bond transfer layers for manufacturable sealing of microfluidic chips |
Joshua T. Smith, Chao Wang, Benjamin H. Wunsch |
2017-10-24 |
| 9748131 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker |
2017-08-29 |
| 9648782 |
Chip stack structures that implement two-phase cooling with radial flow |
Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong |
2017-05-09 |
| 9636782 |
Wafer debonding using mid-wavelength infrared radiation ablation |
Bing Dang, John U. Knickerbocker |
2017-05-02 |
| 9606142 |
Test probe substrate |
Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski |
2017-03-28 |
| 9601364 |
Low temperature adhesive resins for wafer bonding |
Robert David Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker |
2017-03-21 |
| 9586291 |
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release |
Bing Dang, John U. Knickerbocker, Eric P. Lewandowski |
2017-03-07 |
