Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9821418 | Adsorption heat exchanger devices | Javier V. Goicochea, Bruno Michel, Patrick Ruch | 2017-11-21 |
| 9698089 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick +1 more | 2017-07-04 |
| 9648782 | Chip stack structures that implement two-phase cooling with radial flow | Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang | 2017-05-09 |
| 9576922 | Silver alloying post-chip join | Eric D. Perfecto, Jonas Zuercher | 2017-02-21 |