Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9698089 | Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section | Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Gerd Schlottig +1 more | 2017-07-04 |
| 9576922 | Silver alloying post-chip join | Thomas J. Brunschwiler, Eric D. Perfecto | 2017-02-21 |