KM

Keiji Matsumoto

SE Seiko Epson: 4 patents #142 of 1,351Top 15%
IBM: 4 patents #1,576 of 10,852Top 15%
Canon: 3 patents #463 of 3,775Top 15%
KT Kabushiki Kaisha Toshiba: 1 patents #924 of 2,455Top 40%
MC Murata Manufacturing Co.: 1 patents #252 of 596Top 45%
Overall (2017): #4,082 of 506,227Top 1%
13
Patents 2017

Issued Patents 2017

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
9809027 Method of manufacturing structure and method of manufacturing liquid ejection head Jun Yamamuro, Kazuhiro Asai, Kunihito Uohashi, Seiichiro Yaginuma, Masahisa Watanabe +3 more 2017-11-07
9789690 Method for manufacturing liquid ejection head Masahisa Watanabe, Jun Yamamuro, Kazuhiro Asai, Koji Sasaki, Kunihito Uohashi +6 more 2017-10-17
9728433 Attitude changing apparatus, aligning apparatus, attitude changing method and aligning method Masatoshi Harada, Atsushi Kudo 2017-08-08
9697914 Nuclear power plant and passive containment cooling system Takashi Sato 2017-07-04
9698089 Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate section Thomas J. Brunschwiler, Dominic Gschwend, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick +1 more 2017-07-04
9669630 Method for manufacturing liquid ejection head Seiichiro Yaginuma, Koji Sasaki 2017-06-06
9672323 Reduction of warpage of multilayered substrate or package Sayuri Hada 2017-06-06
9643426 Liquid ejecting apparatus Masahiko Sato, Shigenori Nakagawa, Toshinobu Yamazaki 2017-05-09
9630413 Liquid recovery containers and liquid ejection apparatus Shuhei Harada, Manabu Yamada 2017-04-25
9610767 Liquid ejecting apparatus Shigenori Nakagawa, Masahiko Sato, Toshinobu Yamazaki, Toshiyuki Suzuki, Takeshi Yoshida 2017-04-04
9573387 Printing apparatus and printing method Tomoki Shinoda, Kazuyuki Fujioka 2017-02-21
9568405 Method, apparatus, and structure for determining interposer thickness Sayuri Hada, Akihiro Horibe 2017-02-14
9558311 Surface region selection for heat sink placement 2017-01-31