Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9672323 | Reduction of warpage of multilayered substrate or package | Keiji Matsumoto | 2017-06-06 |
| 9568405 | Method, apparatus, and structure for determining interposer thickness | Akihiro Horibe, Keiji Matsumoto | 2017-02-14 |