Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853006 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Charles L. Arvin, Harry D. Cox, Thomas A. Wassick | 2017-12-26 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Jorge A. Lubguban, Jennifer D. Schuler | 2017-08-08 |
| 9689084 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Charles L. Arvin, Harry D. Cox | 2017-06-27 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma | 2017-03-28 |
| 9576922 | Silver alloying post-chip join | Thomas J. Brunschwiler, Jonas Zuercher | 2017-02-21 |