| 9853006 |
Semiconductor device contact structure having stacked nickel, copper, and tin layers |
Charles L. Arvin, Harry D. Cox, Thomas A. Wassick |
2017-12-26 |
| 9728440 |
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer |
Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Jorge A. Lubguban, Jennifer D. Schuler |
2017-08-08 |
| 9689084 |
Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
Charles L. Arvin, Harry D. Cox |
2017-06-27 |
| 9607973 |
Method for establishing interconnects in packages using thin interposers |
Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma |
2017-03-28 |
| 9576922 |
Silver alloying post-chip join |
Thomas J. Brunschwiler, Jonas Zuercher |
2017-02-21 |
