Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852960 | Underfill dispensing using funnels | Evan G. Colgan, Michael A. Gaynes, Donald A. Merte | 2017-12-26 |
| 9822002 | Flexible electronics for wearable healthcare sensors | Paul S. Andry, Huan Hu | 2017-11-21 |
| 9824925 | Flip chip alignment mark exposing method enabling wafer level underfill | Mukta G. Farooq, Kevin S. Petrarca, Nicholas A. Polomoff | 2017-11-21 |
| 9679875 | Reduced volume interconnect for three-dimensional chip stack | Peter A. Gruber, Da-Yuan Shih | 2017-06-13 |
| 9670061 | Flexible electronics for wearable healthcare sensors | Huan Hu, Ning Li, Xiao Hu Liu | 2017-06-06 |
| 9633925 | Visualization of alignment marks on a chip covered by a pre-applied underfill | Mukta G. Farooq, Jae-Woong Nah | 2017-04-25 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Eric D. Perfecto | 2017-03-28 |
| 9543273 | Reduced volume interconnect for three-dimensional chip stack | Peter A. Gruber, Da-Yuan Shih | 2017-01-10 |