Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824925 | Flip chip alignment mark exposing method enabling wafer level underfill | Mukta G. Farooq, Kevin S. Petrarca, Katsuyuki Sakuma | 2017-11-21 |
| 9754823 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Brian M. Erwin, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler | 2017-09-05 |
| 9748135 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Brian M. Erwin, Jennifer D. Schuler, Matthew E. Souter, Christopher L. Tessler | 2017-08-29 |