Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824925 | Flip chip alignment mark exposing method enabling wafer level underfill | Mukta G. Farooq, Nicholas A. Polomoff, Katsuyuki Sakuma | 2017-11-21 |
| 9728450 | Insulating a via in a semiconductor substrate | Mukta G. Farooq, Jennifer A. Oakley, Nicole R. Reardon, Andrew H. Simon | 2017-08-08 |
| 9673095 | Protected through semiconductor via (TSV) | Mukta G. Farooq, Jennifer A. Oakley, Richard P. Volant | 2017-06-06 |