| 9852980 |
Interconnect structure having substractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig |
2017-12-26 |
| 9793216 |
Fabrication of IC structure with metal plug |
Joyeeta Nag, Jim Shih-Chun Liang, Domingo A. Ferrer Luppi, Atsushi Ogino, Michael P. Chudzik |
2017-10-17 |
| 9728450 |
Insulating a via in a semiconductor substrate |
Mukta G. Farooq, Jennifer A. Oakley, Kevin S. Petrarca, Nicole R. Reardon |
2017-08-08 |
| 9685404 |
Back-end electrically programmable fuse |
Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi +3 more |
2017-06-20 |
| 9679810 |
Integrated circuit having improved electromigration performance and method of forming same |
Joyeeta Nag, Shishir Ray, Oleg Gluschenkov, Siddarth A. Krishnan, Michael P. Chudzik |
2017-06-13 |
| 9673089 |
Interconnect structure with enhanced reliability |
Griselda Bonilla, Kaushik Chanda, Robert D. Edwards, Ronald G. Filippi, Ping-Chuan Wang |
2017-06-06 |
| 9601513 |
Subsurface wires of integrated chip and methods of forming |
Terence B. Hook, Andreas Scholze, Lars Liebmann, Roger QUON |
2017-03-21 |
| 9601426 |
Interconnect structure having subtractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig |
2017-03-21 |
| 9536830 |
High performance refractory metal / copper interconnects to eliminate electromigration |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig |
2017-01-03 |
| 9536842 |
Structure with air gap crack stop |
Junjing Bao, Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Xiao Hu Liu +1 more |
2017-01-03 |
