| 9852980 |
Interconnect structure having substractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon |
2017-12-26 |
| 9806023 |
Selective and non-selective barrier layer wet removal |
Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha |
2017-10-31 |
| 9793193 |
Air gap and air spacer pinch off |
Griselda Bonilla, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2017-10-17 |
| 9786760 |
Air gap and air spacer pinch off |
Griselda Bonilla, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini |
2017-10-10 |
| 9759766 |
Electromigration test structure for Cu barrier integrity and blech effect evaluations |
Griselda Bonilla, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin |
2017-09-12 |
| 9711455 |
Method of forming an air gap semiconductor structure with selective cap bilayer |
Stephen M. Gates, Dimitri Kioussis, Christopher J. Penny, Deepika Priyadarshini |
2017-07-18 |
| 9685406 |
Selective and non-selective barrier layer wet removal |
Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha |
2017-06-20 |
| 9666529 |
Method and structure to reduce the electric field in semiconductor wiring interconnects |
Takeshi Nogami, Raghuveer R. Patlolla, Christopher J. Penny, Theodorus E. Standaert |
2017-05-30 |
| 9601426 |
Interconnect structure having subtractive etch feature and damascene feature |
Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon |
2017-03-21 |
