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Elbert E. Huang — 9 Patents in 2017

IBM: 9 patents #517 of 10,852Top 5%

Mountain View, CA: #40 of 2,209 inventorsTop 2%

California: #1,384 of 60,394 inventorsTop 3%

Overall (2017): #9,528 of 506,227Top 2%

9 Patents 2017

Issued Patents 2017

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9852980	Interconnect structure having substractive etch feature and damascene feature	Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon	2017-12-26	$2,704,000
9806023	Selective and non-selective barrier layer wet removal	Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha	2017-10-31	$5,356,000
9793193	Air gap and air spacer pinch off	Griselda Bonilla, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini	2017-10-17	$4,096,000
9786760	Air gap and air spacer pinch off	Griselda Bonilla, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini	2017-10-10	$2,342,000
9759766	Electromigration test structure for Cu barrier integrity and blech effect evaluations	Griselda Bonilla, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin	2017-09-12	$1,776,000
9711455	Method of forming an air gap semiconductor structure with selective cap bilayer	Stephen M. Gates, Dimitri Kioussis, Christopher J. Penny, Deepika Priyadarshini	2017-07-18	$2,009,000
9685406	Selective and non-selective barrier layer wet removal	Benjamin D. Briggs, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha	2017-06-20	$2,315,000
9666529	Method and structure to reduce the electric field in semiconductor wiring interconnects	Takeshi Nogami, Raghuveer R. Patlolla, Christopher J. Penny, Theodorus E. Standaert	2017-05-30	$1,983,000
9601426	Interconnect structure having subtractive etch feature and damascene feature	Griselda Bonilla, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon	2017-03-21	$2,195,000