Issued Patents 2017
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-12-26 |
| 9817063 | Interconnect reliability structures | Ping-Chuan Wang, Andrew Tae Kim | 2017-11-14 |
| 9768065 | Interconnect structures with variable dopant levels | Ping-Chuan Wang, Erdem Kaltalioglu, Cathryn J. Christiansen | 2017-09-19 |
| 9761539 | Wafer rigidity with reinforcement structure | Erdem Kaltalioglu, Andrew Tae Kim, Ping-Chuan Wang | 2017-09-12 |
| 9741657 | TSV deep trench capacitor and anti-fuse structure | Erdem Kaltalioglu, Shahab Siddiqui, Ping-Chuan Wang, Lijuan Zhang | 2017-08-22 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Griselda Bonilla, Kaushik Chanda, Samuel S. Choi, Stephan Grunow +3 more | 2017-06-20 |
| 9673089 | Interconnect structure with enhanced reliability | Griselda Bonilla, Kaushik Chanda, Robert D. Edwards, Andrew H. Simon, Ping-Chuan Wang | 2017-06-06 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Griselda Bonilla, Samuel S. Choi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-03-21 |
| 9536779 | Selective local metal cap layer formation for improved electromigration behavior | Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2017-01-03 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Xiao Hu Liu, Naftali E. Lustig +1 more | 2017-01-03 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Junjing Bao, Griselda Bonilla, Samuel S. Choi, Naftali E. Lustig, Andrew H. Simon | 2017-01-03 |