Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851397 | Electromigration testing of interconnect analogues having bottom-connected sensory pins | Fen Chen, Deborah M. Massey, Prakash Periasamy, Michael A. Shinosky | 2017-12-26 |
| 9831194 | Edge compression layers | Tom C. Lee, Ian McCallum-Cook, Anthony K. Stamper | 2017-11-28 |
| 9780031 | Wiring structures | Fen Chen, Roger A. Dufresne, Charles W. Griffin | 2017-10-03 |
| 9768065 | Interconnect structures with variable dopant levels | Ping-Chuan Wang, Erdem Kaltalioglu, Ronald G. Filippi | 2017-09-19 |
| 9685370 | Titanium tungsten liner used with copper interconnects | Jonathan D. Chapple-Sokol, Jeffrey P. Gambino, Tom C. Lee, William J. Murphy, Anthony K. Stamper | 2017-06-20 |