Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831194 | Edge compression layers | Cathryn J. Christiansen, Ian McCallum-Cook, Anthony K. Stamper | 2017-11-28 |
| 9704852 | Electrostatic discharge and passive structures integrated in a vertical gate fin-type field effect diode | Robert J. Gauthier, Jr., You Li, Rahul Mishra, Souvick Mitra, Andreas Scholze | 2017-07-11 |
| 9685370 | Titanium tungsten liner used with copper interconnects | Jonathan D. Chapple-Sokol, Cathryn J. Christiansen, Jeffrey P. Gambino, William J. Murphy, Anthony K. Stamper | 2017-06-20 |
| 9575115 | Methodology of grading reliability and performance of chips across wafer | Nathaniel R. Chadwick, James P. Di Sarro, Robert J. Gauthier, Jr., Junjun Li, Souvick Mitra +2 more | 2017-02-21 |
| 9536870 | SCR with fin body regions for ESD protection | James P. Di Sarro, Robert J. Gauthier, Jr., Junjun Li, Souvick Mitra, Christopher S. Putnam | 2017-01-03 |