Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852999 | Wafer reinforcement to reduce wafer curvature | Andrew Tae Kim, Chengwen Pei, Ping-Chuan Wang | 2017-12-26 |
| 9768065 | Interconnect structures with variable dopant levels | Ping-Chuan Wang, Ronald G. Filippi, Cathryn J. Christiansen | 2017-09-19 |
| 9761539 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Andrew Tae Kim, Ping-Chuan Wang | 2017-09-12 |
| 9741657 | TSV deep trench capacitor and anti-fuse structure | Ronald G. Filippi, Shahab Siddiqui, Ping-Chuan Wang, Lijuan Zhang | 2017-08-22 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Wei Lin, Spyridon Skordas, Kevin R. Winstel | 2017-01-24 |
| 9536779 | Selective local metal cap layer formation for improved electromigration behavior | Ronald G. Filippi, Ping-Chuan Wang, Lijuan Zhang | 2017-01-03 |