Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852999 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Chengwen Pei, Ping-Chuan Wang | 2017-12-26 |
| 9817063 | Interconnect reliability structures | Ping-Chuan Wang, Ronald G. Filippi | 2017-11-14 |
| 9761539 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang | 2017-09-12 |