| 9852999 |
Wafer reinforcement to reduce wafer curvature |
Erdem Kaltalioglu, Andrew Tae Kim, Chengwen Pei |
2017-12-26 |
| 9818652 |
Commonly-bodied field-effect transistors |
Chengwen Pei, Kai D. Feng |
2017-11-14 |
| 9817063 |
Interconnect reliability structures |
Andrew Tae Kim, Ronald G. Filippi |
2017-11-14 |
| 9780426 |
Phase shifter, accelerator and method of operating the same |
Kejun Kang, Jiaru Shi, Chuanxiang Tang, Huaibi Chen, Yaohong Liu +2 more |
2017-10-03 |
| 9772371 |
Voltage-driven intelligent characterization bench for semiconductor |
Charles J. Montrose |
2017-09-26 |
| 9768065 |
Interconnect structures with variable dopant levels |
Erdem Kaltalioglu, Ronald G. Filippi, Cathryn J. Christiansen |
2017-09-19 |
| 9768110 |
Physical unclonable interconnect function array |
Kai D. Feng, Wai-Kin Li, Zhijian Yang |
2017-09-19 |
| 9761539 |
Wafer rigidity with reinforcement structure |
Ronald G. Filippi, Erdem Kaltalioglu, Andrew Tae Kim |
2017-09-12 |
| 9755013 |
High density capacitor structure and method |
Wai-Kin Li, Chengwen Pei |
2017-09-05 |
| 9741657 |
TSV deep trench capacitor and anti-fuse structure |
Ronald G. Filippi, Erdem Kaltalioglu, Shahab Siddiqui, Lijuan Zhang |
2017-08-22 |
| 9721854 |
Structure and method for in-line defect non-contact tests |
Hanyi Ding, Kai D. Feng, Zhijian Yang |
2017-08-01 |
| 9702930 |
Semiconductor wafer probing system including pressure sensing and control unit |
Robert D. Edwards, Oleg Gluschenkov, Louis V. Medina, Tso-Hui Ting, Yongchun Xin |
2017-07-11 |
| 9691718 |
On-chip semiconductor device having enhanced variability |
Wai-Kin Li, Chengwen Pei |
2017-06-27 |
| 9673089 |
Interconnect structure with enhanced reliability |
Griselda Bonilla, Kaushik Chanda, Robert D. Edwards, Ronald G. Filippi, Andrew H. Simon |
2017-06-06 |
| 9576914 |
Inducing device variation for security applications |
Wai-Kin Li, Chengwen Pei |
2017-02-21 |
| 9536829 |
Programmable electrical fuse in keep out zone |
Mukta G. Farooq, Timothy D. Sullivan, Lijuan Zhang |
2017-01-03 |
| 9536779 |
Selective local metal cap layer formation for improved electromigration behavior |
Ronald G. Filippi, Erdem Kaltalioglu, Lijuan Zhang |
2017-01-03 |
