Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852980 | Interconnect structure having substractive etch feature and damascene feature | Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-12-26 |
| 9793193 | Air gap and air spacer pinch off | Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini | 2017-10-17 |
| 9786760 | Air gap and air spacer pinch off | Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Christopher J. Penny, Deepika Priyadarshini | 2017-10-10 |
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Elbert E. Huang, Chao-Kun Hu, Baozhen Li, Paul S. McLaughlin | 2017-09-12 |
| 9685404 | Back-end electrically programmable fuse | Junjing Bao, Kaushik Chanda, Samuel S. Choi, Ronald G. Filippi, Stephan Grunow +3 more | 2017-06-20 |
| 9673089 | Interconnect structure with enhanced reliability | Kaushik Chanda, Robert D. Edwards, Ronald G. Filippi, Andrew H. Simon, Ping-Chuan Wang | 2017-06-06 |
| 9601426 | Interconnect structure having subtractive etch feature and damascene feature | Samuel S. Choi, Ronald G. Filippi, Elbert E. Huang, Naftali E. Lustig, Andrew H. Simon | 2017-03-21 |
| 9536830 | High performance refractory metal / copper interconnects to eliminate electromigration | Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Naftali E. Lustig, Andrew H. Simon | 2017-01-03 |
| 9536842 | Structure with air gap crack stop | Junjing Bao, Samuel S. Choi, Ronald G. Filippi, Xiao Hu Liu, Naftali E. Lustig +1 more | 2017-01-03 |