| 9852946 |
Self aligned conductive lines |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2017-12-26 |
| 9837485 |
High-density MIM capacitors |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2017-12-05 |
| 9837355 |
Method for maximizing air gap in back end of the line interconnect through via landing modification |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2017-12-05 |
| 9837305 |
Forming deep airgaps without flop over |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2017-12-05 |
| 9824982 |
Structure and fabrication method for enhanced mechanical strength crack stop |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2017-11-21 |
| 9793206 |
Heterogeneous metallization using solid diffusion removal of metal interconnects |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2017-10-17 |
| 9793213 |
Ion flow barrier structure for interconnect metallization |
James J. Demarest, James J. Kelly, Koichi Motoyama, Oscar van der Straten |
2017-10-17 |
| 9793193 |
Air gap and air spacer pinch off |
Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2017-10-17 |
| 9786554 |
Self aligned conductive lines |
Sean D. Burns, Lawrence A. Clevenger, Anuja E. DeSilva, Nelson Felix, Sivananda K. Kanakasabapathy +3 more |
2017-10-10 |
| 9786760 |
Air gap and air spacer pinch off |
Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini |
2017-10-10 |
| 9780027 |
Hybrid airgap structure with oxide liner |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2017-10-03 |
| 9779944 |
Method and structure for cut material selection |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Nelson Felix, Sivananda K. Kanakasabapathy +3 more |
2017-10-03 |
| 9773700 |
Aligning conductive vias with trenches |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2017-09-26 |
| 9711455 |
Method of forming an air gap semiconductor structure with selective cap bilayer |
Stephen M. Gates, Elbert E. Huang, Dimitri Kioussis, Deepika Priyadarshini |
2017-07-18 |
| 9685366 |
Forming chamferless vias using thermally decomposable porefiller |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Michael Rizzolo |
2017-06-20 |
| 9666529 |
Method and structure to reduce the electric field in semiconductor wiring interconnects |
Elbert E. Huang, Takeshi Nogami, Raghuveer R. Patlolla, Theodorus E. Standaert |
2017-05-30 |
| 9666528 |
BEOL vertical fuse formed over air gap |
Marc A. Bergendahl, James J. Demarest, Christopher J. Waskiewicz |
2017-05-30 |
| 9607943 |
Capacitors |
Veeraraghavan S. Basker, Kangguo Cheng, Theodorus E. Standaert, Junli Wang |
2017-03-28 |
| 9607886 |
Self aligned conductive lines with relaxed overlay |
Sean D. Burns, Lawrence A. Clevenger, Matthew E. Colburn, Sivananda K. Kanakasabapathy, Yann Mignot +2 more |
2017-03-28 |
| 9553019 |
Airgap protection layer for via alignment |
Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo |
2017-01-24 |
