Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793213 | Ion flow barrier structure for interconnect metallization | James J. Demarest, Koichi Motoyama, Christopher J. Penny, Oscar van der Straten | 2017-10-17 |
| 9780035 | Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects | Benjamin D. Briggs, Koichi Motoyama, Roger A. Quon, Michael Rizzolo, Theodorus E. Standaert | 2017-10-03 |
| 9716065 | Via bottom structure and methods of forming | Takeshi Nogami | 2017-07-25 |