| 9837305 |
Forming deep airgaps without flop over |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2017-12-05 |
| 9837485 |
High-density MIM capacitors |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2017-12-05 |
| 9837355 |
Method for maximizing air gap in back end of the line interconnect through via landing modification |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny |
2017-12-05 |
| 9824982 |
Structure and fabrication method for enhanced mechanical strength crack stop |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2017-11-21 |
| 9793206 |
Heterogeneous metallization using solid diffusion removal of metal interconnects |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2017-10-17 |
| 9778007 |
Matching a spent firearm cartridge |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo |
2017-10-03 |
| 9780035 |
Structure and method for improved stabilization of cobalt cap and/or cobalt liner in interconnects |
Benjamin D. Briggs, James J. Kelly, Koichi Motoyama, Roger A. Quon, Theodorus E. Standaert |
2017-10-03 |
| 9758095 |
Smartwatch blackbox |
Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha |
2017-09-12 |
| 9760817 |
Security key system |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo |
2017-09-12 |
| 9754883 |
Hybrid metal interconnects with a bamboo grain microstructure |
Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang |
2017-09-05 |
| 9754891 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition |
Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Takeshi Nogami, Deepika Priyadarshini |
2017-09-05 |
| 9754885 |
Hybrid metal interconnects with a bamboo grain microstructure |
Benjamin D. Briggs, Lawrence A. Clevenger, Chih-Chao Yang |
2017-09-05 |
| 9685366 |
Forming chamferless vias using thermally decomposable porefiller |
Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny |
2017-06-20 |
| 9666474 |
Uniform dielectric recess depth during fin reveal |
Benjamin D. Briggs, Lawrence A. Clevenger, Jay William Strane |
2017-05-30 |
| 9583498 |
Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element |
Benjamin D. Briggs, Lawrence A. Clevenger |
2017-02-28 |
| 9559107 |
Structure and method for BEOL nanoscale damascene sidewall-defined non-volatile memory element |
Benjamin D. Briggs, Lawrence A. Clevenger |
2017-01-31 |
| 9553019 |
Airgap protection layer for via alignment |
Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny |
2017-01-24 |
| 9548243 |
Self aligned via and pillar cut for at least a self aligned double pitch |
Benjamin D. Briggs, Lawrence A. Clevenger, Terry A. Spooner, Theodorus E. Standaert |
2017-01-17 |
