Issued Patents 2017
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852990 | Cobalt first layer advanced metallization for interconnects | Daniel C. Edelstein | 2017-12-26 |
| 9853025 | Thin film metallic resistors formed by surface treatment of insulating layer | — | 2017-12-26 |
| 9852981 | III-V compatible anti-fuses | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-12-26 |
| 9847261 | Metal reflow for middle of line contacts | Juntao Li, Junli Wang | 2017-12-19 |
| 9842805 | Drive-in Mn before copper plating | Hsueh-Chung Chen | 2017-12-12 |
| 9837535 | Directional deposition of protection layer | Hong He, Juntao Li, Junli Wang | 2017-12-05 |
| 9837356 | Interconnect structures with enhanced electromigration resistance | — | 2017-12-05 |
| 9831301 | Metal resistor structures with nitrogen content | — | 2017-11-28 |
| 9831181 | Simultaneous formation of liner and metal conductor | Daniel C. Edelstein | 2017-11-28 |
| 9831182 | Multiple pre-clean processes for interconnect fabrication | Terry A. Spooner, Wei Wang | 2017-11-28 |
| 9824917 | Method and apparatus for single chamber treatment | Daniel C. Edelstein | 2017-11-21 |
| 9824967 | Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-11-21 |
| 9812391 | Advanced metallization for damage repair | Daniel C. Edelstein | 2017-11-07 |
| 9812522 | Metal-insulator-metal capacitor fabrication with unitary sputtering process | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-11-07 |
| 9806018 | Copper interconnect structures | Lawrence A. Clevenger, Wei Wang | 2017-10-31 |
| 9806024 | Simultaneous formation of liner and metal conductor | Daniel C. Edelstein | 2017-10-31 |
| 9799605 | Advanced copper interconnects with hybrid microstructure | Daniel C. Edelstein | 2017-10-24 |
| 9793207 | Electrical antifuse including phase change material | — | 2017-10-17 |
| 9793156 | Self-aligned low resistance metallic interconnect structures | — | 2017-10-17 |
| 9786596 | Fuse formed from III-V aspect ratio structure | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-10-10 |
| 9786553 | Advanced BEOL interconnect structure containing uniform air gaps | — | 2017-10-10 |
| 9786603 | Surface nitridation in metal interconnects | Lawrence A. Clevenger, Roger A. Quon, Terry A. Spooner, Wei Wang | 2017-10-10 |
| 9786605 | Advanced through substrate via metallization in three dimensional semiconductor integration | Daniel C. Edelstein | 2017-10-10 |
| 9786595 | Antifuse having comb-like top electrode | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2017-10-10 |
| 9773735 | Geometry control in advanced interconnect structures | — | 2017-09-26 |