Issued Patents 2017
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852990 | Cobalt first layer advanced metallization for interconnects | Chih-Chao Yang | 2017-12-26 |
| 9831181 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-11-28 |
| 9824917 | Method and apparatus for single chamber treatment | Chih-Chao Yang | 2017-11-21 |
| 9812391 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-11-07 |
| 9806024 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-10-31 |
| 9799605 | Advanced copper interconnects with hybrid microstructure | Chih-Chao Yang | 2017-10-24 |
| 9786605 | Advanced through substrate via metallization in three dimensional semiconductor integration | Chih-Chao Yang | 2017-10-10 |
| 9773737 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-09-26 |
| 9761529 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-09-12 |
| 9728399 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-08-08 |
| 9721835 | Modulating microstructure in interconnects | Chih-Chao Yang | 2017-08-01 |
| 9721788 | Simultaneous formation of liner and metal conductor | Chih-Chao Yang | 2017-08-01 |
| 9716063 | Cobalt top layer advanced metallization for interconnects | Chih-Chao Yang | 2017-07-25 |
| 9716088 | 3D bonded semiconductor structure with an embedded capacitor | Chih-Chao Yang | 2017-07-25 |
| 9702042 | Method and apparatus for single chamber treatment | Chih-Chao Yang | 2017-07-11 |
| 9691705 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2017-06-27 |
| 9691656 | Self-forming embedded diffusion barriers | Cyril Cabral, Jr., Juntao Li, Takeshi Nogami | 2017-06-27 |
| 9659817 | Structure and process for W contacts | Baozhen Li, Chih-Chao Yang | 2017-05-23 |
| 9653403 | Structure and process for W contacts | Baozhen Li, Chih-Chao Yang | 2017-05-16 |
| 9653567 | Lateral bipolar transistor | Fabio Carta, Stephen M. Gates, Bahman Hekmatshoartabari, Tak H. Ning | 2017-05-16 |
| 9646931 | Formation of liner and metal conductor | Chih-Chao Yang | 2017-05-09 |
| 9620479 | 3D bonded semiconductor structure with an embedded resistor | Chih-Chao Yang | 2017-04-11 |
| 9620481 | Substrate bonding with diffusion barrier structures | Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more | 2017-04-11 |
| 9601432 | Advanced metallization for damage repair | Chih-Chao Yang | 2017-03-21 |
| 9601371 | Interconnect structure with barrier layer | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha | 2017-03-21 |