| 9852990 |
Cobalt first layer advanced metallization for interconnects |
Chih-Chao Yang |
2017-12-26 |
$2,704,000 |
| 9831181 |
Simultaneous formation of liner and metal conductor |
Chih-Chao Yang |
2017-11-28 |
$4,993,000 |
| 9824917 |
Method and apparatus for single chamber treatment |
Chih-Chao Yang |
2017-11-21 |
$3,803,000 |
| 9812391 |
Advanced metallization for damage repair |
Chih-Chao Yang |
2017-11-07 |
$4,555,000 |
| 9806024 |
Simultaneous formation of liner and metal conductor |
Chih-Chao Yang |
2017-10-31 |
$5,356,000 |
| 9799605 |
Advanced copper interconnects with hybrid microstructure |
Chih-Chao Yang |
2017-10-24 |
$3,030,000 |
| 9786605 |
Advanced through substrate via metallization in three dimensional semiconductor integration |
Chih-Chao Yang |
2017-10-10 |
$2,342,000 |
| 9773737 |
Advanced metallization for damage repair |
Chih-Chao Yang |
2017-09-26 |
$3,108,000 |
| 9761529 |
Advanced metallization for damage repair |
Chih-Chao Yang |
2017-09-12 |
$1,776,000 |
| 9728399 |
Simultaneous formation of liner and metal conductor |
Chih-Chao Yang |
2017-08-08 |
$2,569,000 |
| 9721835 |
Modulating microstructure in interconnects |
Chih-Chao Yang |
2017-08-01 |
$1,638,000 |
| 9721788 |
Simultaneous formation of liner and metal conductor |
Chih-Chao Yang |
2017-08-01 |
$1,638,000 |
| 9716063 |
Cobalt top layer advanced metallization for interconnects |
Chih-Chao Yang |
2017-07-25 |
$2,827,000 |
| 9716088 |
3D bonded semiconductor structure with an embedded capacitor |
Chih-Chao Yang |
2017-07-25 |
$2,827,000 |
| 9702042 |
Method and apparatus for single chamber treatment |
Chih-Chao Yang |
2017-07-11 |
$1,748,000 |
| 9691705 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects |
Donald F. Canaperi, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more |
2017-06-27 |
$2,603,000 |
| 9691656 |
Self-forming embedded diffusion barriers |
Cyril Cabral, Jr., Juntao Li, Takeshi Nogami |
2017-06-27 |
$2,603,000 |
| 9659817 |
Structure and process for W contacts |
Baozhen Li, Chih-Chao Yang |
2017-05-23 |
$2,171,000 |
| 9653403 |
Structure and process for W contacts |
Baozhen Li, Chih-Chao Yang |
2017-05-16 |
$2,370,000 |
| 9653567 |
Lateral bipolar transistor |
Fabio Carta, Stephen M. Gates, Bahman Hekmatshoartabari, Tak H. Ning |
2017-05-16 |
$2,370,000 |
| 9646931 |
Formation of liner and metal conductor |
Chih-Chao Yang |
2017-05-09 |
$2,584,000 |
| 9620479 |
3D bonded semiconductor structure with an embedded resistor |
Chih-Chao Yang |
2017-04-11 |
$2,654,000 |
| 9620481 |
Substrate bonding with diffusion barrier structures |
Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas, Tuan A. Vo +1 more |
2017-04-11 |
$14,156,000 |
| 9601432 |
Advanced metallization for damage repair |
Chih-Chao Yang |
2017-03-21 |
$2,195,000 |
| 9601371 |
Interconnect structure with barrier layer |
Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini, Hosadurga Shobha |
2017-03-21 |
$2,195,000 |
