Issued Patents 2017
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9589894 | Copper interconnect structure and its formation | Takeshi Nogami, Christopher C. Parks, Tsong-Lin Tai | 2017-03-07 |
| 9583410 | Volumetric integrated circuit and volumetric integrated circuit manufacturing method | Michael A. Gaynes, Thomas M. Shaw, Bucknell C. Webb, Roy R. Yu | 2017-02-28 |
| 9536780 | Method and apparatus for single chamber treatment | Chih-Chao Yang | 2017-01-03 |