Issued Patents 2017
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847295 | Enhancing barrier in air gap technology | Wei Lin | 2017-12-19 |
| 9837350 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Raghuveer R. Patlolla | 2017-12-05 |
| 9793193 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Christopher J. Penny, Deepika Priyadarshini | 2017-10-17 |
| 9786760 | Air gap and air spacer pinch off | Griselda Bonilla, Elbert E. Huang, Son V. Nguyen, Christopher J. Penny, Deepika Priyadarshini | 2017-10-10 |
| 9754891 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Chao-Kun Hu, Deepika Priyadarshini, Michael Rizzolo | 2017-09-05 |
| 9716065 | Via bottom structure and methods of forming | James J. Kelly | 2017-07-25 |
| 9711456 | Composite manganese nitride/low-K dielectric cap | Donald F. Canaperi, Son V. Nguyen, Deepika Priyadarshini | 2017-07-18 |
| 9691705 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Donald F. Canaperi, Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-06-27 |
| 9691656 | Self-forming embedded diffusion barriers | Cyril Cabral, Jr., Daniel C. Edelstein, Juntao Li | 2017-06-27 |
| 9666529 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Elbert E. Huang, Raghuveer R. Patlolla, Christopher J. Penny, Theodorus E. Standaert | 2017-05-30 |
| 9601371 | Interconnect structure with barrier layer | Daniel C. Edelstein, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2017-03-21 |
| 9589894 | Copper interconnect structure and its formation | Daniel C. Edelstein, Christopher C. Parks, Tsong-Lin Tai | 2017-03-07 |