Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837350 | Semiconductor interconnect structure with double conductors | Benjamin D. Briggs, Takeshi Nogami | 2017-12-05 |
| 9806023 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2017-10-31 |
| 9685406 | Selective and non-selective barrier layer wet removal | Benjamin D. Briggs, Elbert E. Huang, Cornelius Brown Peethala, David L. Rath, Hosadurga Shobha | 2017-06-20 |
| 9666529 | Method and structure to reduce the electric field in semiconductor wiring interconnects | Elbert E. Huang, Takeshi Nogami, Christopher J. Penny, Theodorus E. Standaert | 2017-05-30 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Matthew T. Shoudy +2 more | 2017-05-02 |