Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Binglin Miao +2 more | 2017-05-02 |
| 9607825 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-03-28 |
| 9558934 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-01-31 |
| 9558935 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-01-31 |
| 9536733 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-01-03 |