Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Baozhen Li, Paul S. McLaughlin | 2017-09-12 |
| 9754891 | Low-temperature diffusion doping of copper interconnects independent of seed layer composition | Benjamin D. Briggs, Lawrence A. Clevenger, Takeshi Nogami, Deepika Priyadarshini, Michael Rizzolo | 2017-09-05 |