Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Baozhen Li | 2017-09-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Baozhen Li | 2017-09-12 |