Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9759766 | Electromigration test structure for Cu barrier integrity and blech effect evaluations | Griselda Bonilla, Elbert E. Huang, Chao-Kun Hu, Baozhen Li | 2017-09-12 |
PM
Paul S. McLaughlin
Overall (2017): #285,322 of 506,227Top 60%
1
Patents 2017