Issued Patents 2017
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852981 | III-V compatible anti-fuses | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-12-26 |
| 9842770 | Reflow enhancement layer for metallization structures | Alexander Reznicek, Oscar van der Straten | 2017-12-12 |
| 9837357 | Method to reduce variability in contact resistance | Hemanth Jagannathan, Christian Lavoie, Jean L. Sweet | 2017-12-05 |
| 9831254 | Multiple breakdown point low resistance anti-fuse structure | Adra Carr, Alexander Reznicek, Oscar van der Straten | 2017-11-28 |
| 9824967 | Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-11-21 |
| 9812522 | Metal-insulator-metal capacitor fabrication with unitary sputtering process | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-11-07 |
| 9805989 | Sacrificial cap for forming semiconductor contact | Zuoguang Liu, Shogo Mochizuki, Jie Yang, Chun Wing Yeung | 2017-10-31 |
| 9805973 | Dual silicide liner flow for enabling low contact resistance | Veeraraghavan S. Basker, Zuoguang Liu, Tenko Yamashita, Chun-Chen Yeh | 2017-10-31 |
| 9786595 | Antifuse having comb-like top electrode | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-10-10 |
| 9786596 | Fuse formed from III-V aspect ratio structure | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-10-10 |
| 9768077 | Low resistance dual liner contacts for Fin Field-Effect Transistors (FinFETs) | Veeraraghavan S. Basker, Zuoguang Liu | 2017-09-19 |
| 9741812 | Dual metal interconnect structure | Hemanth Jagannathan, Koichi Motoyama, Oscar van der Straten | 2017-08-22 |
| 9735165 | Vertically stacked FinFET fuse | Alexander Reznicek, Oscar van der Straten | 2017-08-15 |
| 9722038 | Metal cap protection layer for gate and contact metallization | Hemanth Jagannathan, Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-08-01 |
| 9679807 | Method, apparatus, and system for MOL interconnects without titanium liner | Vimal Kamineni, Mark V. Raymond, Chengyu Niu | 2017-06-13 |
| 9613899 | Epitaxial semiconductor fuse for FinFET structure | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-04-04 |
| 9576957 | Self-aligned source/drain contacts | Emre Alptekin, Kangguo Cheng, Balasubramanian Pranatharthiharan, Shom Ponoth | 2017-02-21 |
| 9570574 | Recessed metal liner contact with copper fill | Veeraraghavan S. Basker, Huiming Bu, Zuoguang Liu | 2017-02-14 |
| 9564310 | Metal-insulator-metal capacitor fabrication with unitary sputtering process | Alexander Reznicek, Oscar van der Straten, Chih-Chao Yang | 2017-02-07 |