Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9837305 | Forming deep airgaps without flop over | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2017-12-05 |
| 9837485 | High-density MIM capacitors | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2017-12-05 |
| 9824982 | Structure and fabrication method for enhanced mechanical strength crack stop | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2017-11-21 |
| 9793206 | Heterogeneous metallization using solid diffusion removal of metal interconnects | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2017-10-17 |
| 9685366 | Forming chamferless vias using thermally decomposable porefiller | Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Christopher J. Penny, Michael Rizzolo | 2017-06-20 |