| 9852946 |
Self aligned conductive lines |
Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more |
2017-12-26 |
| 9842737 |
Self-aligned quadruple patterning process |
Sivananda K. Kanakasabapathy, Fee Li Lie, Stuart A. Sieg |
2017-12-12 |
| 9779944 |
Method and structure for cut material selection |
Sean D. Burns, Lawrence A. Clevenger, Nelson Felix, Sivananda K. Kanakasabapathy, Yann Mignot +3 more |
2017-10-03 |
| 9773700 |
Aligning conductive vias with trenches |
Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more |
2017-09-26 |
| 9659824 |
Graphoepitaxy directed self-assembly process for semiconductor fin formation |
Joy Cheng, Michael A. Guillorn, Chi-Chun Liu, Melia Tjio, HsinYu Tsai |
2017-05-23 |
| 9607886 |
Self aligned conductive lines with relaxed overlay |
Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more |
2017-03-28 |
| 9601345 |
Fin trimming in a double sit process |
Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz |
2017-03-21 |
| 9563122 |
Method to harden photoresist for directed self-assembly processes |
Joy Cheng, Chi-Chun Liu |
2017-02-07 |
